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商品简介]：
SOLDER PASTE
SN96CI PF-23 H F M Q
WHY LEAD FREE?
Increasing consumer awareness of the toxicity of lead is prompting the electronics industry to move to lead free
materials in their manufacturing processes. In some countries, the timetable for the elimination of lead from
electronics is being set by governments. However, most companies are motivated primarily by their wish to supply
their customers with products that will not contribute lead to the environment at any stage in their life cycle from
manufacture to eventual disposal.
ADVANTAGES OF SN96CI PF-23 H F M Q
Extensive research by the electronics industry during the 1990s identified the tin-silver-copper eutectic as one of
the best alternatives to lead-containing solders. The three constituent metals are readily available in quantities
sufficient to meet any likely demand for solder by the electronics industry and their non-toxicity is undisputed.
Since they are already used extensively in the electronics industry they do not contribute any new problems to the
recycling of electronic circuitry when it has reached the end of its useful life. The Ames Laboratory of the
University of Iowa, U.S.A. studied the properties of the tin-silver-copper system as they relate to its use as a solder
the uniqueness of which was reflected in the granting of US Patent No 6231691. This patent included methods of
further enhancing the properties of the alloy by trace quaternary additions. Nihon Superior is a licensee of this
patent and has taken full advantage of its scope to develop the SN96 alloy. SN96 solidifies to produce a stable
uniform microstructure over a wide range of cooling rates.
The PF-23flux medium has been developed by Nihon Superior to cope well with the higher reflow temperature of
the tin-silver-copper eutectic while giving good wetting to ensure full fillet formation and maximum coverage. The
F indicates a particle size range of 45-20μm, which ensures good printing down to 0.4mm pitch. The M indicates a
metal content optimized for stencil printing. The Q indicates spherical solder powder. This combination of
specifications ensures that the paste meets all of the requirements of current printing, placement and reflow
processes.
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